Brief: We tested it—see the highlights and what to expect in real operation. This video provides a comprehensive guide to achieving bubble-free panels, demonstrating why PUR hot melt adhesive is the superior lamination glue for MDF boards. Watch as we showcase its application process, waterproof performance, and key benefits for woodworking and aluminum profile wrapping.
Related Product Features:
One-component reactive polyurethane hot melt adhesive for easy application and strong bonding.
Waterproof and resistant to humidity, heat, and chemicals for durable performance.
Suitable for laminating PVC and TPU to wood, MDF, plastic, and aluminum profiles.
Available in flexible packaging options: 2kg bags, 20kg barrels, and 200kg barrels.
High strength bonding with a wide temperature adaptability from 120°C to 140°C.
Features a softening point of 78 ± 5°C and melt viscosity of 50,000 mPa·s at 120°C.
Long storage life of 2 years when kept at recommended temperatures of 5–35°C.
Ideal for bubble-free panel lamination in woodworking and industrial wrapping applications.
FAQs:
What materials can this PUR hot melt adhesive bond?
This adhesive is designed for wrapping and coating PVC to various substrates, including wood plastic boards, foaming boards, MDF panels, and aluminum profiles, making it versatile for woodworking and industrial lamination.
How should this adhesive be stored and what is its shelf life?
Store the adhesive at a temperature between 5°C and 35°C, sealed tightly if not fully used. It has a storage time of 2 years to maintain its effectiveness and performance.
What are the key application temperatures for this PUR hot melt glue?
The service temperature for application ranges from 120°C to 140°C, with a softening point of 78 ± 5°C, ensuring optimal melt viscosity and strong adhesion during the lamination process.
Is this adhesive resistant to environmental factors?
Yes, it offers high resistance to humidity, heat, and chemicals, providing reliable, waterproof bonding suitable for demanding conditions in woodworking and profile wrapping applications.